Microneedling helps to reverse the effects of aging by improving fine lines, wrinkles, large pores, and uneven texture. A short and comfortable procedure with little to no downtime.
This simple non- surgical procedure will jump-start new collagen stimulation and reduce fine lines and wrinkles. Skin pen is gaining popularity to a healthier, cost-effective alternative to other skin rejuvenating procedures.
Microneedling, also known as collagen induction therapy, is a minimally invasive skin rejuvenation procedure that helps reduce the signs of aging for all skin types. Microneedling procedures create hundreds of controlled micro-“injuries” in the skin and promote the skin’s self-repair mechanisms; this triggers new collagen and elastin formation and the production of growth factors. The result is a smoother, younger-looking skin.
Three phases of this process:
Phase I: Inflammation. Piercing the skin triggers your immune system to disinfect the wounds, remove debris, increase blood flow and begin to create new tissue.
Phase II: Proliferation. The wound is re-built with new granulation cells, as well as a temporary collagen and elastin, which are part of the extracellular matrix. Also, a new network of blood vessels develops.
Phase III: Remodeling. The wound has been replaced with new dermal tissues and blood vessels. The type III collagen in the newly formed tissue is replaced with stronger type I collagen, which can contract to create a tightening or “shrink wrap” effect on the skin.
What to expect after treatment:
The total healing time depends on each individual.
Afterwards, you can expect to experience effects similar to mild sunburns; typically some redness, tenderness and some swelling. This typically happens and lasts for 48 hours. There is very little to no significant downtime after a procedure.
To optimize your investment and results:
What you don’t put on your skin is as important as what you do! Follow the post-procedure protocol for the first 48 hours and thereafter care for your skin to optimize results.